Home / Equipment / Focused Ion Beam - Nova 200 NanoLab (FEI)

Contact

Karl Weiss
John M. Cowley Center for High Resolution Electron Microscopy Manager
Karl.Weiss@asu.edu
480.965.3831

Ken Mossman
Research Specialist
kenneth.c.mossman@asu.edu
480.965.8163

Dan Thompson
Contact for Industry, Tech Marketing and Sales Coordinator
Dan.Thompson@asu.edu
480.727.8578

Focused Ion Beam - Nova 200 NanoLab (FEI)

The Nova NanoLab brings advanced capabilities and flexibility to researchers and developers needing to create, modify, and characterize complex structures below 100 nanometers. It combines ultra-high resolution field emission scanning electron microscopy (SEM) and precise focused ion beam (FIB) etch and deposition to complement your existing Nanotechnology laboratory tools and extend your applications range for nanoscale prototyping, machining, 2D and 3D-characterization, and analysis.

It comes equipped with integrated 3D-characterization and nano-machining. Future capabilities will include nano-analysis. It is also capable of comprehensive beam chemistries for deposition and etch, and automation, along with nano-analysis. Some typical Nanotechnology applications are:

  • TEM sample preparation
  • Nanotube-based nano-structure assembly
  • Nano-bridge creation
  • Photonic array prototyping
  • Laser prototyping
  • Nano-stamping
  • AFM tip modification
  • MEMS modification

Nova NanoLab enables characterization of these structures via several methods, among them slice and view for 3D-reconstruction, ultra-high resolution in-lens backscattered electron imaging for phase contrast characterization, secondary ion imaging for grain contrast, SPI- simultaneous patterning and imaging mode for real-time imaging feedback on the milling process, and STEM for sub-1 nm characterization.

Electron Optics

  • High-resolution Field Emission-SEM column, with monopole magnetic immersion final lens, Schottky thermal field emitter, 60 degree objective lens geometry and heated objective apertures.
  • Resolution @ optimum WD
    • 1.1 nm @ 15 kV (TLD-SE)
    • 2.5 nm @ 1 kV (TLD-SE)
    • 3.5 nm @ 500V TLD-SE
    • 5.5 nm @ 500 V TLD-BSE
  • Resolution @ beam coincidence point
    • 1.0 nm @ 30 kV STEM
    • 1.5 nm @ 15 kV (TLD-SE)
    • 2.0 nm @ 5 kV (TLD-SE)
  • Max. Horizontal field width: 3.0 mm at beam coincidence point (corresponds to 35x minimum magnification in quad view)
  • Accelerating voltage: 200 V – 30 kV
  • Probe current: <= 20 nA in 21 steps

Detectors

  • ETD--Everhart-Thornley Detector for detecting secondary electrons, backscattered electrons, with additional custom capabilities.
  • TLD-Through the Lens Detector for detecting secondary electrons, backscattered electrons, with additional custom capabilities.
  • CDEM-Continuous-Dynode Electron Multiplier for secondary electron detection, with additional custom capabilities.

Digital image processor

  • Dwell: 50 ns - 1 ms
  • 11 presets + photo + snapshot
  • Up to 3584 x 3094 pixel resolution
  • File type: TIFF (8 or 16 bit), BMP or JPEG
  • Single frame or 4-quadrant image display
  • 4 quadrants live
  • 256 frame average or integration

Tools for Nano-prototyping

  • Ion Optics:
    • Magnum™ ion column with Ga liquid metal ion source
    • Resolution: 7 nm (5 nm achievable)
    • Max. Horizontal field width: 2.5 mm at 5 kV and beams coincidence point (corresponds to 50x minimum magnification in quad view)
    • Accelerating voltage: 5 – 30 kV
    • Probe current: 1 pA – 20 nA in 15 steps
    • Beam blanker standard – external control possible
    • 15 position aperture strip
  • Fabrication and machining:
    • Minimum deposited line width (Ion beam, Pt): 50 nm achievable
    • Minimum deposited line width (Electron beam, Pt): 20 nm
    • Minimum etched line width (Si): <15 nm achievable
    • Maximum hole aspect ratio (Si, 500 nm hole radius): 10:1
    • Maximum hole aspect ratio (Si, 500 nm hole radius, XeF2, coaxial needle): 20:1
    • Typical TEM sample prep membrane thickness: 50 - 100 nm (30 - 50 nm achievable)
  • Digital pattern generator:
    • 4 k x 4 k resolution
    • 1 M pixels addressable
    • Min. dwell: 100 ns
    • Max. dwell: 4 ms
  • Gas chemistry:
    • “Zero-collision” GIS design concept
      • Individual gas injectors with separate injections systems reconfigurable in the future
      • 5 µm placing accuracy without user interaction
    • Gas chemistry options:
      • Platinum metal deposition
      • Carbon deposition

Techniques

Links: 

Equipment information can be viewed at the manufacture’s website.

Rates

Cost for ASU Internal Cost for ASU Internal with Staff Assistance Cost for Other Academic/Non-Profit Cost for Other Academic/Non-Profit with Staff Assistance
$60 $95 $120 $195

Training Requirements

All training is currently being scheduled by Karl Weiss, Karl.Weiss@asu.edu (480)965-3831(480)965-3831

Note: All users must attend the ASU Lab Safety and Fire Safety courses prior to using any CHREM facility.

Safety

Emergency Information

See ASU Emergency Procedures and Information for emergency procedures for any of the following: Personal Threat or Assault, Power Outage, Major Accidents, Flooding, Hazardous Materials Incident, Radiation Spills, Biological Spills, Suspicious Packages, Natural Disaster & Inclement Weather, Bomb Threat, Evacuation, Medical Emergency, Personal Injury, and Fire.

Emergency Phone Numbers

In an emergency, dial 911 from any campus or other phone.

Call the General ASU Emergency Information Phone at 7-9911 (on-campus phone) or 480-727-9911 or toll-free 877-278-2785 (877-ASU-ASU5) to get a recorded message. For non-emergencies, The ASU Department of Public Safety office can be reached at 5-3465 (on-campus phone) or 480-965-3465.

Users must attend the ASU Lab Safety and Fire Safety courses prior to using any LE-CSSS facility.

Examples

More Information

Active users can schedule time using their iLab account with the following link: FIB Nova 200 Schedule

If you are not currently in iLab please click on the following link: iLab registration

  • Reserving time on an instrument means that you agree to pay for the entire time reserved at the standard rate whether you use it or not. This policy ensures the efficient use of instrumentation and discourages researchers from blocking up time that they are not going to use. You will also be billed for any time used that exceeds your reservation.

Access Policies: 

Policies and Procedures for Access, Development and Maintenance

The FEI Nova 200 Dual-Beam FIB has been acquired under the NSF Major Research Instrumentation Program, with additional support from Arizona State University. This instrument will be made available to the ASU and broader community as a user facility, and should facilitate a wide range of applications involving the fabrication of nanostructures. No radioactive samples, and the sample must survive in a vacuum and under the electron beam.